Overview of Copper Plate

A copper plate is a flat sheet made from copper or copper alloys, widely used in various industries including electrical, construction, and decorative arts. Known for its excellent conductivity, corrosion resistance, and aesthetic appeal, copper plates are versatile materials suited for numerous applications.

Features of Copper Plate

High Electrical Conductivity: Exceptional ability to conduct electricity, making it ideal for electrical components.

Corrosion Resistance: Resists corrosion and oxidation, ensuring long-lasting performance.

Thermal Conductivity: Efficient in conducting heat, useful in heat exchangers and cookware.

Malleability and Ductility: Can be easily shaped into complex forms without breaking.

Antimicrobial Properties: Naturally resists bacterial growth, beneficial in medical and food industries.

Aesthetic Appeal: Offers a unique color and finish, enhancing architectural and artistic projects.

(99.99% Indium Tin Oxide/ ITO Sputtering Target Bonding With Copper Plate)

Specifications of 99.99% Indium Tin Oxide/ ITO Sputtering Target Bonding With Copper Plate

This product is a high-purity Indium Tin Oxide sputtering target bonded securely to a copper backing plate. It is designed for demanding thin-film deposition processes. ITO targets create transparent conductive coatings essential for electronics. The copper plate provides vital support and cooling during sputtering. This bonding prevents cracking and warping common with pure ceramic targets.

The ITO layer offers 99.99% purity. This ensures consistent film quality and excellent electrical properties. The standard composition is 90% Indium Oxide and 10% Tin Oxide. Custom ratios are available upon request. Common target sizes include diameters like 2 inches, 3 inches, and larger. Thickness typically ranges from 0.125 inches to 0.250 inches. The copper backing plate thickness is usually 0.125 inches. Dimensions can be customized to fit specific sputtering systems.

A strong, reliable bond connects the ITO to the copper plate. We use advanced bonding techniques. This bond guarantees excellent thermal conductivity. Heat transfers efficiently from the ITO during sputtering. This minimizes target overheating and potential damage. The bond also withstands the mechanical stresses of high-power deposition. It ensures long target life and stable performance.

The target surface is precisely machined. It is flat and smooth for uniform film deposition. Surface roughness is carefully controlled. This prevents arcing and particle generation during the sputtering run. Each target undergoes strict quality checks. We verify purity, dimensions, bonding strength, and surface condition. The product is shipped in protective packaging. This prevents damage and contamination during transit.

These bonded ITO targets are crucial for manufacturing touchscreens, flat panel displays, and solar cells. They enable high-quality, transparent conductive layers. The copper backing makes them suitable for high-power applications.

(99.99% Indium Tin Oxide/ ITO Sputtering Target Bonding With Copper Plate)

Applications of 99.99% Indium Tin Oxide/ ITO Sputtering Target Bonding With Copper Plate

99.99% pure ITO sputtering targets bonded with copper plates are vital for making thin film coatings. These coatings are transparent and conduct electricity well. The copper plate backing offers big advantages. It helps the target handle high power during sputtering. This means faster coating production. The copper also pulls heat away quickly. This stops the target from getting too hot. A cooler target works better and lasts longer. It saves money by reducing downtime and replacement costs.

These bonded targets are used everywhere. They make the touch layers in smartphones and tablets. Your device screen responds to touch because of the ITO coating. The same coating is applied to flat panel displays like LCDs and OLED TVs. It creates the clear electrode layer needed for sharp images. Solar panels also use this technology. ITO coatings help capture sunlight efficiently and turn it into power.

Electrochromic windows, often called smart windows, rely on these bonded targets too. The ITO layer lets the window change tint electronically. Anti-static films for electronics packaging also need these conductive coatings. The bond between the ITO and copper is strong. It stays intact even under tough sputtering conditions. This reliability is crucial for consistent coating quality. Manufacturers trust these bonded targets for large-scale production. They deliver the performance needed for advanced electronics and energy products.

Company Introduction

Welcome to Wgraj, a premier global supplier of high-quality metal cladding solutions. We specialize in providing a wide range of metal cladding products, including aluminum, steel, and copper composites, designed to meet the diverse needs of architects, builders, and designers. Our commitment to innovation, durability, and aesthetic excellence ensures that our clients receive top-tier materials for their projects. With state-of-the-art manufacturing facilities and a dedication to customer satisfaction, we deliver reliable, cost-effective solutions worldwide. Partner with us for your metal cladding needs and experience unmatched quality and service.

If you have any questions, please feel free to contact us(nanotrun@yahoo.com).

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of 99.99% Indium Tin Oxide/ ITO Sputtering Target Bonding With Copper Plate

People often ask why we bond ITO sputtering targets to copper plates. The main reason is heat. Sputtering makes a lot of heat. Copper pulls that heat away fast. This keeps the ITO target cooler. A cooler target works better. It helps prevent cracking. The copper plate also makes the target strong. It supports the brittle ITO material. This support stops the target from breaking during use.

You might wonder how we stick them together. We use a special metal solder. We heat everything under pressure. The solder melts and bonds the ITO to the copper. The bond must be perfect. No gaps or weak spots are allowed. A good bond moves heat efficiently. It also holds the target firmly.

People want to know what makes a good bonded target. Look for a flat surface. The bond should cover the whole area. Check for any warping. Listen for a solid sound when tapped. A hollow sound means trouble. The edges must be clean and sealed. Good bonding ensures steady sputtering. It gives consistent film results.

Handling these bonded targets needs care. Always hold them by the copper plate. Never grab just the ITO side. The ITO is fragile. Dropping it can break the bond. Store the targets flat. Keep them in a dry place. Avoid big temperature changes. Sudden heat or cold can stress the bond.

People ask if the copper affects the film. Usually, it does not. The sputtering process uses the ITO face. The copper stays behind. It just acts as a heat sink and support. The film quality comes from the ITO itself. A good bond helps the ITO perform well. It does not add copper to your film layer.

(99.99% Indium Tin Oxide/ ITO Sputtering Target Bonding With Copper Plate)