Aluminum Silicon Carbide Al/SiC
Al SiC (alluminum silicon carbide) is a metallic-based thermal management compound made up of silicon carbide and aluminum. It is used as a packaging material for electronic parts. The combination of aluminum with high volume frac is what it refers to.
Description Al/SiC
Al SiC (Hyperbolic Silicon Carbide) A metal-based thermal management compound made up of aluminum and silica carbide. This is an electronic packaging material. In order to prevent thermal failures in electronic circuits, it is the mixture of high volume silicon carbide and aluminum.
Specifications for Aluminum Matrix Composites
Materials
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Density = g/cm3.
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Modulus of Elasticity GPa
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Strength MPa
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Coefficient 10-6 of expansion beats K
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Thermo conductivity W / 1 m
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SiC/Al
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15vol%SiC/Al
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2.82
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100+-5
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560
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17.0+-1
|
150+-5
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20vol%SiC/Al
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2.85
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110+-5
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580
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16.0+-1
|
160+-5
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25vol%SiC/Al
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2.86
|
115+-5
|
600
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14.3+-1
|
170+-5
|
30vol%SiC/Al
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2.89
|
125+-5
|
560
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13.1+-1
|
175+-5
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45vol%SiC/Al
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2.92
|
160+-5
|
500
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11.5+-1
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190+-5
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55vol%SiC/Al
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2.95
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195+-5
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450
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9.5+-1
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200+-5
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60vol%SiC/Al
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2.98
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200+-5
|
420
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8.3+-1
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205+-5
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65vol%SiC/Al
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3.01
|
215+-5
|
400
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7.5+-1
|
210+-5
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70vol%SiC/Al
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3.02
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220+-5
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380
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7.0+-1
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215+-5
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Properties of Aluminum Silicon Carbide Aluminium/SiC
Silicon caride aluminum SiC/Almatrix compounds have many exceptional advantages. They are ideal for optomechanical systems that require high stability.
Example: (1) Superior structural stability (static rigidity, dynamic stiffness), wherein the elastic modulus of titanium alloy is twice that of the aluminum alloy. Specific stiffness and specific stiffness are also three times higher than the aluminum alloy and titanium alloy. (2) Excellent thermal control stability: The coefficient of thermal expansion of titanium alloy can be as low as 20%, while the temperature conductivity of the titanium alloy is 30%.
Aluminum Silicon Carbide - Al/SiC
Al/SiC meets the semiconductor integration needs according to Moore's law. This results in a dramatic increase in silicon chip calorific values, decreased service lives, and "light-weight and thin" electronic packaging development.
In aerospace especially, the use of microwave integrated circuits and power modules for military RF systems chips is a prominent trend.
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