Overview of Copper Plate

A copper plate is a flat sheet made from copper or copper alloys, widely used in various industries including electrical, construction, and decorative arts. Known for its excellent conductivity, corrosion resistance, and aesthetic appeal, copper plates are versatile materials suited for numerous applications.

Features of Copper Plate

High Electrical Conductivity: Exceptional ability to conduct electricity, making it ideal for electrical components.

Corrosion Resistance: Resists corrosion and oxidation, ensuring long-lasting performance.

Thermal Conductivity: Efficient in conducting heat, useful in heat exchangers and cookware.

Malleability and Ductility: Can be easily shaped into complex forms without breaking.

Antimicrobial Properties: Naturally resists bacterial growth, beneficial in medical and food industries.

Aesthetic Appeal: Offers a unique color and finish, enhancing architectural and artistic projects.

Specifications of Aluminum Silicon Copper Alloy Sputtering Targets AlSiCu 98.5/1/0.5wt% Disc Plates Rod Target

AlSiCu 98.5/ 1/0.5 wt% Sputtering Targets

Product Make-up and Type

These sputtering targets are made from an aluminum-silicon-copper alloy with a specific make-up of 98.5% aluminum , 1% silicon , and 0.5% copper by weight. This specific mix delivers exceptional electric conductivity and solid bond to substratums. The product is readily available in three basic forms: discs , plates , and rods . Each kind is very carefully machined to meet tight dimensional resistances for consistent performance in thin-film deposition processes.

Pureness and Quality Assurance

The alloy maintains a total metallic pureness of 99.99% (4N) or higher. Pollutants such as iron, zinc, and magnesium are purely limited to guarantee movie harmony and tool dependability. Every set goes through strenuous top quality checks, including chemical analysis and microstructure assessment. This guarantees low issue density and secure sputtering prices during procedure.

Physical Qualities

The AlSiCu target features a fine, uniform grain framework that minimizes arcing and particle generation during sputtering. Its thickness normally goes beyond 99% of academic , which assists protect against splitting or deforming under thermal anxiety. The surface coating is smooth and tidy, prepared for straight installment in most sputtering systems without extra prep work.

Applications

This alloy is widely used in the semiconductor industry for producing adjoin layers in integrated circuits. It is also ideal for flat panel screens, solar cells, and progressed product packaging innovations. The small addition of silicon reduces hillock development, while copper improves electromigration resistance– both vital for high-performance digital gadgets.

Modification Options

Criterion dimensions consist of usual diameters like 2″, 3″, and 6″ for discs, yet customized measurements and bonding options (such as indium or epoxy backing) are available upon request. All targets are packaged in cleanroom problems to stay clear of contamination prior to use.

Applications of Aluminum Silicon Copper Alloy Sputtering Targets AlSiCu 98.5/1/0.5wt% Disc Plates Rod Target

AlSiCu 98.5/ 1/0.5 Sputtering Targets: Accuracy Product for Advanced Thin Films

High-Purity Composition for Reliable Performance

Our aluminum silicon copper (AlSiCu) sputtering targets include 98.5% aluminum, 1% silicon, and 0.5% copper by weight. This exact mix supplies solid electrical conductivity and outstanding thermal stability. The product is optimal for making thin movies made use of in semiconductor production and microelectronics. Each target is made with limited control over purity and homogeneity to make certain constant results during sputtering.

Flexible Kinds for Various Deposition Requirements

We offer AlSiCu targets in multiple forms: discs , layers , and poles . Discs work well in basic magnetron sputtering systems. Plates fit large-area finishing applications. Rods are made use of in specialized setups like cylindrical magnetrons. All forms are machined to specific measurements and surface finishes, lowering problems and enhancing movie harmony.

Built for Demanding Semiconductor Processes

The tiny enhancement of silicon prevents hillock development– small bumps that can ruin circuit patterns. Copper increases electromigration resistance, which helps circuits last longer under high current lots. These homes make AlSiCu 98.5/ 1/0.5 a relied on choice for interconnect layers in incorporated circuits. The alloy also bonds well with usual substrates like silicon wafers and glass.

Quality You Can Trust

Every batch undergoes rigorous top quality checks. We evaluate for chemical composition, thickness, grain framework, and surface area tidiness. Targets are packed in cleanroom conditions to avoid contamination. This focus to detail guarantees smooth assimilation into your assembly line and reduces downtime. Whether you run high-volume fabs or R&D laboratories, our AlSiCu sputtering targets support secure, repeatable deposition runs.

Company Introduction

Welcome to Wgraj, a premier global supplier of high-quality metal cladding solutions. We specialize in providing a wide range of metal cladding products, including aluminum, steel, and copper composites, designed to meet the diverse needs of architects, builders, and designers. Our commitment to innovation, durability, and aesthetic excellence ensures that our clients receive top-tier materials for their projects. With state-of-the-art manufacturing facilities and a dedication to customer satisfaction, we deliver reliable, cost-effective solutions worldwide. Partner with us for your metal cladding needs and experience unmatched quality and service.

If you have any questions, please feel free to contact us(nanotrun@yahoo.com).

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Aluminum Silicon Copper Alloy Sputtering Targets AlSiCu 98.5/1/0.5wt% Disc Plates Rod Target

Frequently Asked Questions: Aluminum Silicon Copper Alloy Sputtering Targets (AlSiCu 98.5/1/0.5 wt%)

What is an AlSiCu sputtering target?

An AlSiCu sputtering target is a disc, plate, or rod made from an aluminum alloy with 1% silicon and 0.5% copper by weight. It is used in physical vapor deposition (PVD) processes to create thin conductive films on semiconductor wafers and other electronic components.

Why use AlSiCu instead of pure aluminum?

Pure aluminum films can suffer from electromigration and poor thermal stability. Adding small amounts of silicon and copper improves resistance to electromigration, enhances adhesion, and increases the film’s reliability under high current and temperature conditions.

What forms are available for this alloy?

This alloy comes in several standard shapes: round discs, flat plates, and cylindrical rods. The form you choose depends on your sputtering system design and application requirements. All forms meet strict purity and density standards for consistent performance.

How is quality controlled during production?

Each batch undergoes rigorous inspection. We check chemical composition using spectroscopy. Density, grain structure, and surface finish are also verified. This ensures uniform sputtering rates and minimal defects in the deposited films.

Which industries use AlSiCu sputtering targets?

These targets are mainly used in semiconductor manufacturing, especially for integrated circuits and microchips. They are also found in display technologies, solar cells, and advanced sensors where stable, low-resistance metal layers are needed.