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Tellurium dioxide dissolution: a solution for the future environment! tellurium metal

According to appropriate reports, greenhouse gas discharges continue to raise, causing environment modification and environmental air pollution. In this situation, carbon exhausts are significantly minimized to stop warming and air pollution problems…

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Research on the epoxy plastic encapsulant industry for semiconductors

EMC (epoxy molding compound) is a semiconductor packaging material used in most application semiconductor end products, such as general household appliances such as mobile phones, refrigerators and TVs, industrial equipment, and automobiles. With the…

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New Discovery of Semiconductor Chip Heat Dissipation Hexagonal Boron Nitride Seamless Growth on the Surface of Materials

Hexagonalboron nitride, also known as white graphite, has a layered structure that is similar to graphite. It has excellent lubricity, thermal conductivity and electrical insulation, as well as chemical resistance. It is chemically inert to all forms…

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Cuprous Oxide as a Semiconductor Material

The European Union recently approved sweeping new sanctions against Russia, including bans on imports of coal, timber, chemicals, and other Cu2O powder. Si and GaN are major players in semiconductor materials. One material that keeps com…

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Tin Antimonide (SnSb) CAS 28980-49-6 Powder Semiconductor Materials

KMPASS is a professional tin antimonide supplier to provide high quality tin antimonide SnSb Powder.…

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GaN-on-diamond semiconductor materials can withstand temperatures, about the molybdenum disulfide coating suppliers you should know

GaN-on-diamond semiconductor materials can withstand temperatures -- 1,000 degrees to be exact. About the molybdenum disulfide coating suppliers you should know. Today demand for more powerful electronic devices is limited by our ability to produce h…

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Semiconductor nanoparticles form many structures, as you should know about the molybdenum disulfide coating

New materials for a sustainable future you should know about the molybdenum disulfide coating. Historically, knowledge and the production of new materials molybdenum disulfide coating have contributed to human and social progress, from the refining o…

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Why aluminum silicon carbide has high toughness

What is Aluminum Silicon Carbide?Aluminum silicon carbide is one type of electronic packaging materials that are used for electronic components. It refers mainly to the combination between aluminum and silicon carbide, with high volume, into low dens…

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High Purity Silicon Dioxide SiO2 powder CAS 7631-86-9, 99.9%

Silicon dioxide is also called silica. It's an oxide of silicon and has the chemical composition SiO2. Silica, which includes silica found in quartz and quartz sand, is collectively called silica.Particle size: 10-30nm Purity: 99.5-99.9% Silicon Di…

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Waterproof agent

Gypsum waterproofing agent is a technology that involves the development of gypsum to help achieve watertight concrete structures. TRUNNANO Gypsum waterproofing technology is available as a waterproof for gypsum concrete, or an integral admixture fo…

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Metal Alloy 8.92g/Cm3 High Purity Polished Copper Plate

Metal Alloy 18.5g/cm3 Polished Tungsten Heavy Alloy Plate

Metal Alloy 18g/cm3 High Density Tungsten Alloy Ball

High Purity Molybdenum Boride MoB2 Powder CAS 12006-99-4, 99%

Metal Alloy High Density Tungsten Alloy Rod Grind Surface Tungsten Alloy Bar

High Purity Germanium Sulfide GeS2 Powder CAS 12025-34-2, 99.99%

High Purity Tungsten Silicide WSi2 Powder CAS 12039-88-2, 99%

High Purity Titanium Sulfide TiS2 Powder CAS 2039-13-3, 99.99%

High Purity Calcium Nitride Ca3N2 Powder CAS 12013-82-0, 99.5%

High Purity Nano Hafnium Hf powder CAS 7440-58-6, 99%

High Purity Nano Ag Silver powder cas 7440-22-4, 99%

High Purity 3D Printing Nickel-based Alloy IN738 Powder

High Purity Chromium Diboride CrB2 Powder CAS 12007-16-8, 99%

High Purity Silicon Sulfide SiS2 Powder CAS 13759-10-9, 99.99%

Supply Magnesium Granules Mg Granules 99.95%

High Purity 3D Printing Powder 15-5 Stainless Steel Powder

High Purity 3D Printing 304 Stainless Steel Powder

High Purity Zirconium Nitride ZrN Powder CAS 25658-42-8, 99.5%

High Purity Tungsten Boride WB2 Powder CAS 12007-09-9, 99%

High Purity Silicon Nitride Si3N4 Powder CAS 12033-89-5, 99%