4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

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Description

Overview of Copper Plate

A copper plate is a flat sheet made from copper or copper alloys, widely used in various industries including electrical, construction, and decorative arts. Known for its excellent conductivity, corrosion resistance, and aesthetic appeal, copper plates are versatile materials suited for numerous applications.

Features of Copper Plate

High Electrical Conductivity: Exceptional ability to conduct electricity, making it ideal for electrical components.

Corrosion Resistance: Resists corrosion and oxidation, ensuring long-lasting performance.

Thermal Conductivity: Efficient in conducting heat, useful in heat exchangers and cookware.

Malleability and Ductility: Can be easily shaped into complex forms without breaking.

Antimicrobial Properties: Naturally resists bacterial growth, beneficial in medical and food industries.

Aesthetic Appeal: Offers a unique color and finish, enhancing architectural and artistic projects.

4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

(4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating)

Specifications of 4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

These 4N ITO ceramic sputtering targets bond to copper backing plates. ITO means Indium Tin Oxide. It is a special ceramic material. We use it to make thin films. These films are transparent. They conduct electricity well. The “4N” part is important. It shows the purity level. 4N means 99.99% pure. High purity is crucial for performance. Impurities cause problems. They make the films less effective.

The ITO powder mix is precise. The ratio is typically 90% Indium. The other 10% is Tin Oxide. This ratio gives the best properties. The ceramic target is dense. It is sintered carefully. This ensures good structure. The target bonds firmly to a copper plate. Copper is an excellent backing material. It conducts heat very efficiently. Good heat transfer is vital. It stops the target from getting too hot during sputtering. Overheating damages the target. It can ruin the film quality.

The copper plate provides strong support. It makes the target assembly sturdy. This is needed for handling. It is needed for mounting in the machine. The bond between ITO and copper is robust. It uses a special process. This bond must survive harsh conditions. High power sputtering is intense. The bond stays intact. This prevents failures.

These targets work in different sputtering systems. DC magnetron sputtering is common. RF sputtering uses them too. They deposit ITO films onto various surfaces. Glass substrates are coated often. Plastic films also get these coatings. The films are for many applications. Touchscreens need transparent conductors. Flat panel displays use them. Solar cells benefit from ITO layers. Smart windows incorporate these films. LEDs often have ITO electrodes.

4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

(4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating)

Applications of 4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

These 4N ITO ceramic sputtering targets bonded to copper backing plates are essential tools for creating thin film coatings. The target itself is made from high-purity indium tin oxide ceramic. This material provides the source atoms needed for the coating process. The copper plate is firmly bonded to the back of the ITO ceramic. This bond is very important. It creates a strong physical connection between the ceramic and the metal. This setup is designed for sputtering applications.

The copper backing plate serves several key functions. It acts as a robust support structure for the brittle ITO ceramic. This support prevents cracking or breaking during handling and use. Copper is also an excellent conductor of heat. It efficiently pulls heat away from the ITO target during sputtering. Keeping the target cool is vital. It helps maintain stable sputtering conditions. It also extends the overall lifespan of the target. The bond ensures good thermal contact. Heat transfers effectively from the ceramic to the cooling system via the copper.

These bonded targets are used in many important technologies. They deposit transparent conductive oxide (TCO) films. Touchscreens rely heavily on these conductive layers. Flat panel displays like LCDs and OLEDs also use them for electrodes. Thin-film solar panels incorporate ITO layers made using these targets. The films enable light transmission and electrical conductivity. Other applications include electrochromic windows and certain sensor types. The high purity (4N) ensures consistent film properties. The copper backing delivers reliable thermal management and mechanical stability. This combination supports high-quality, repeatable thin film production.

Company Introduction

Welcome to Wgraj, a premier global supplier of high-quality metal cladding solutions. We specialize in providing a wide range of metal cladding products, including aluminum, steel, and copper composites, designed to meet the diverse needs of architects, builders, and designers. Our commitment to innovation, durability, and aesthetic excellence ensures that our clients receive top-tier materials for their projects. With state-of-the-art manufacturing facilities and a dedication to customer satisfaction, we deliver reliable, cost-effective solutions worldwide. Partner with us for your metal cladding needs and experience unmatched quality and service.

If you have any questions, please feel free to contact us(nanotrun@yahoo.com).

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of 4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

Here are 5 FAQs about our 4N ITO Ceramic Sputtering Targets bonded to Copper Backing Plates:

What is this product?
This is a sputtering target. It is made from Indium Tin Oxide (ITO) ceramic. The ITO is bonded to a copper backing plate. The ITO is high purity, 99.99%. It is used in thin film coating processes.

Why use ITO targets?
ITO targets create transparent conductive coatings. These coatings are essential for many devices. Examples include touchscreens, flat panel displays, and solar cells. The coating conducts electricity. It is also see-through.

What does “4N” mean?
“4N” means the material purity is 99.99%. This high purity level is critical. It ensures the deposited thin film has excellent electrical properties. It also ensures optical clarity. Impurities can ruin performance.

Why bond ITO to copper?
ITO ceramic is brittle. Bonding it to a tough copper backing plate provides strong support. This prevents cracking during sputtering. Copper also conducts heat very well. This helps dissipate heat from the target during use. Good heat management protects the target. It also keeps the coating process stable.

How do I handle these targets?
Handle these targets with extreme care. The ITO ceramic part is fragile. Avoid impacts or bending. Keep the sputtering surface clean. Do not touch it directly. Use clean gloves. Store the targets properly before use. Protect them from moisture and dust. Follow all safety procedures.

4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating

(4N ITO Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate for Thin Film Coating)

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