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GaN is a semiconductor material of third generation with a large forbidden-band width. It has superior properties compared to first-generation Si or second-generation GaAs. GaN devices, due to the large band gaps and high thermal conductivity of GaN…

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Nano-diamond is the key to efficient hydrogen purification, the molybdenum disulfide coating introduction of new materials

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3D Printing Alloy Spherical Copper Powder

The Spherical Copper Powder, Chemical Formula Cu, Submicron and Nanopowder Forms may all be suitable for both industrial and commercial purposes. Information about 3D Printing Aluminum Spherical Copper Pulp: Name of product: Spherical Coppe…

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Metal Alloy 8.92g/Cm3 High Purity Polished Copper Plate

Metal Alloy 18.5g/cm3 Polished Tungsten Heavy Alloy Plate

Metal Alloy 18g/cm3 High Density Tungsten Alloy Ball

High Purity Molybdenum Boride MoB2 Powder CAS 12006-99-4, 99%

Metal Alloy High Density Tungsten Alloy Rod Grind Surface Tungsten Alloy Bar

High Purity Germanium Sulfide GeS2 Powder CAS 12025-34-2, 99.99%

High Purity Tungsten Silicide WSi2 Powder CAS 12039-88-2, 99%

High Purity Titanium Sulfide TiS2 Powder CAS 2039-13-3, 99.99%

High Purity Calcium Nitride Ca3N2 Powder CAS 12013-82-0, 99.5%

High Purity Nano Hafnium Hf powder CAS 7440-58-6, 99%

High Purity Nano Ag Silver powder cas 7440-22-4, 99%

High Purity 3D Printing Nickel-based Alloy IN738 Powder

High Purity Chromium Diboride CrB2 Powder CAS 12007-16-8, 99%

High Purity Silicon Sulfide SiS2 Powder CAS 13759-10-9, 99.99%

Supply Magnesium Granules Mg Granules 99.95%

High Purity 3D Printing Powder 15-5 Stainless Steel Powder

High Purity 3D Printing 304 Stainless Steel Powder

High Purity Zirconium Nitride ZrN Powder CAS 25658-42-8, 99.5%

High Purity Tungsten Boride WB2 Powder CAS 12007-09-9, 99%

High Purity Silicon Nitride Si3N4 Powder CAS 12033-89-5, 99%